Search results：Xiaomi

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Xiaomi Xuanjie O100 Chip Launch: 6nm Process and 3D Stacking Empower AI to Surge at Full Speed

Xiaomi launched Xuanjie O100, its first AI accelerator chip for large models, using a 6nm process and 3D wafer-level stacking to boost bandwidth and integration. It marks a key step in self-developed core computing chips, showing terminal vendors' AI hardware competition deepening.....

08-2422.8K

Xiaomi Releases Xuanjie O100 Chip, With the Highest Edge-side Large Model Inference Speed of 330 TPS

Xiaomi unveiled its first on-device LLM AI accelerator chip, Xuanjie O100. Built on 6nm wafer-level vertical stacking and hybrid bonding with 1.4μm pitch, it delivers 1.22TB/s bandwidth—16x that of flagship phones—and up to 330 TPS inference, boosting on-device LLM throughput and reasoning.....

08-2427.1K